Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore - MPHOnline.com

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Author: Zhang, Hengyun/ Che, Faxing/ Lin, Tingyu/ Zhao, Wensheng
ISBN: 9780081025321
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RM1,817.73
Product Details
PublisherWoodhead Pub LtdPublication DateFormat PaperbackWeight 793.79 gNo. of Pages 418

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