Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Name: Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Brand: Woodhead Pub Ltd
SKU: 9780081025321
Price: 1817.73 MYR
Availability: OutOfStock

Author: Zhang, Hengyun/ Che, Faxing/ Lin, Tingyu/ Zhao, Wensheng

ISBN: 9780081025321

Variants

RM1,817.73

Product Details

Publisher,Woodhead Pub Ltd
Publication Date,November 15, 2019
Format, Paperback
Weight, 793.79 g
No. of Pages, 418

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Customer Reviews

Shop with us

Enquiries

Join Us

Terms of use

Connect with us

Supported payment methods