Tin And Solder Plating In Thesemiconductor Industry ( 1993rd Edition)
Author: A.C.Tan
ISBN: 9780412482403
RM1,067.96
Publisher, Springer
Publication Date,
Format, Hardcover
Weight,
No. of Pages, 348
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
- Dimensions : 6.14 x 0.81 x 9.21 inches
